ANSYS Discovery – Thermal Analysis of Raspberry pi Carrier Backpack Assembly | CFD | Kaizenat

Electronic components are used to control the flow of Electrical currents. Obviously, components restricting the flow of electrons gets heated up. To minimize the Thermal failure scenarios, Thermal analysis is performed. Here, Raspberry pi is the Electronic component. We the Technical team of Simulation engineers at Kaizenat Technologies Private Limited support and train engineers for FEA, CFD, Electronics simulations on tools like ANSYS, LS DYNA, ANSYS Discovery etc. For any technical assistance, please reach us at support@